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Senior Package Engineer

NVIDIAYokneam Ilit, North District, IsraelNot specifiedFull-timeSeniority: Senior

Posted Jun 28 · 61 applicants

Salary not listed for this role

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Willbi insight

The role in plain words

This role involves developing complex microelectronics packaging for future networking products. You will collaborate with internal design teams and external vendors to resolve packaging, manufacturing, and electrical design issues. Day-to-day responsibilities also include leading task forces for failure analysis and supporting high-volume production excursions.

Must-have
  • MSc or equivalent experience in Mechanical Engineering / Materials Engineering / Chemical Engineering or similar
  • At least 8 years of experience with development of complex processes (warpage, heat, optics, Adhesives, etc)
  • Experience co-working with subcontractors and vendors
  • Vision and focus for projects and team
  • Curious and creative problem solver as well as organized and multi-tasker
Nice-to-have
  • Proven record in packaging development
  • Background in semiconductor manufacturing processes and optical systems

Extracted from the job description · kept up to date automatically

Who this suits

This role suits experienced engineers with at least 8 years of experience in complex process development and a background in mechanical, materials, or chemical engineering. It is less ideal for those looking for an entry-level position or those without experience working with subcontractors and vendors.

Full job description

Original listing · kept for reference

At NVIDIA, we are committed to delivering exceptional solutions in a wide range of sectors, and we are looking for engineers who share our passion and dedication to making a difference in the world through their inventions. As a Senior Package Engineer, you will work closely with SI, layout, and ASIC design teams to develop complex, top-of-the-line ASIC packages. You will be responsible for planning schedules, resolving costs, packaging, manufacturing, and electrical design issues.

What You'll Be Doing

• Leading the development of groundbreaking microelectronics packaging for Nvidia Networking Business Unit's future products

• Collaborating with world-leading vendors to develop highly ambitious packaging solutions

• Joining and leading task forces to investigate and support production excursions, failure analysis, and reliability issues

• Failure investigations and production support for High volume products

What We Need To See

• MSc or equivalent experience in Mechanical Engineering / Materials Engineering / Chemical Engineering or similar

• At least 8 years of experience with development of complex processes (warpage, heat, optics, Adhesives, etc).

• Experience co-working with subcontractors and vendors

• Vision and focus for projects and team

• Curious and creative problem solver as well as organized and multi-tasker

• Team oriented, able to move and motivate peers. Strong interpersonal skills (verbal and written)

• High awareness of quality, manufacturability and project schedule

Ways To Stand Out Of The Crowd

• Proven record in packaging development

• Background in semiconductor manufacturing processes and optical systems

Join us at NVIDIA, an equal-opportunity employer that values diversity and inclusion. We do not discriminate on the basis of race, religion, color, national origin, gender, sexual orientation, age, marital status, veteran status, or disability status. We are dedicated to providing reasonable accommodations and adjustments to applicants with disabilities throughout the recruitment process. If you require accommodations, please let us know and we will work with you to meet your needs. Apply now to be part of our world-class team and contribute to the future of computing!

Widely considered to be one of the technology world’s most desirable employers, NVIDIA offers highly competitive salaries and a comprehensive benefits package. As you plan your future, see what we can offer to you and your family www.nvidiabenefits.com/

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NVIDIA
Posted Jun 28 · 61 applicants
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