Sr. Physical Design Engineer
פורסם לפני 13 ימים · 0 מועמדים
התפקיד במילים פשוטות
התפקיד כולל הובלה וביצוע של תהליכי תכנון פיזי (Physical Design) עבור שבבי SoC מורכבים ורכיבי VLSI, החל משלב הסינתזה ועד לחתימה לייצור. העבודה היומיומית כוללת סגירת תזמון (timing closure), תכנון הספק, אינטגרציה של רכיבי IP ופיתוח סקריפטים לאוטומציה של תהליכי התכנון. כמו כן, התפקיד דורש שיתוף פעולה הדוק עם צוותי ה-RTL וספקי כלי EDA חיצוניים.
- B.Sc. in Electrical Engineering, Computer Science, or a related field from a recognized academic institution
- At least 8 years of experience as a Physical Design Engineer
- Strong experience with COT / ASIC physical design flow, including synthesis, floorplanning, P&R, CTS, parasitic extraction, STA, timing closure, physical verification, power analysis, formal verification, DFT / DFM, and ATPG
- Experience with deep sub-micron process technologies, 28nm or below
- Strong understanding of industry-standard design processes for deep sub-micron designs
חולץ מתיאור המשרה · מתעדכן אוטומטית
למי זה מתאים
התפקיד מתאים למהנדסי אלקטרוניקה או מחשבים בעלי ניסיון של לפחות 8 שנים בתכנון פיזי של שבבים (ASIC/COT) בטכנולוגיות של 28 ננומטר ומטה. הוא פחות יתאים למי שאין לו ניסיון מעשי בכתיבת סקריפטים ב-Tcl, Python או Perl, או למי שאינו שולט בכלי הפיתוח של Synopsys או Cadence.
תיאור המשרה המלא
המשרה המקורית · נשמר לעיוןA leading space technology company is developing next-generation satellite communication solutions based on advanced in-house-designed chipsets.
The company operates at the intersection of satellite systems, semiconductor technology, communications infrastructure, and space-grade engineering, supporting complex missions and next-generation connectivity applications.
This is an opportunity to join a highly technical VLSI engineering environment and take part in the physical implementation of complex SoC, VLSI devices, and test chips, integrating custom designs and third-party IP.
Responsibilities
• Own physical implementation of complex SoC, VLSI devices, and test chips, integrating custom designs and third-party IP.
• Lead block-level timing closure and manufacturing signoff, including power planning and power analysis.
• Work closely with Logic Design / RTL teams to develop timing constraints for block-level and chip-level implementation.
• Execute and optimize the physical design flow, including synthesis, floorplanning, place & route, CTS, parasitic extraction, STA, timing closure, physical verification, and formal verification.
• Support DFT test structure insertion, ATPG, chip-level integration, capture, and simulation.
• Work with third-party IP and library suppliers, EDA tool vendors, and subcontract design service providers to improve scripts, tools, and design flow.
• Use scripting languages such as Tcl, Python, or Perl to automate and improve physical design processes.
Required Qualifications
• B.Sc. in Electrical Engineering, Computer Science, or a related field from a recognized academic institution- must.
• At least 8 years of experience as a Physical Design Engineer - must.
• Strong experience with COT / ASIC physical design flow, including synthesis, floorplanning, P&R, CTS, parasitic extraction, STA, timing closure, physical verification, power analysis, formal verification, DFT / DFM, and ATPG- must.
• Experience with deep sub-micron process technologies, 28nm or below - must.
• Strong understanding of industry-standard design processes for deep sub-micron designs- must.
• Practical experience with scripting languages such as Tcl, Python, or Perl - must.
• Experience with at least one major EDA tool flow, such as Cadence or Synopsys - must.
Job No. 500393
שאלות על המשרה
- המשרה לא ציינה שכר. אנחנו מציגים שכר רק כשהמעסיק מפרסם אותו.
- B.Sc. in Electrical Engineering, Computer Science, or a related field from a recognized academic institution, At least 8 years of experience as a Physical Design Engineer, Strong experience with COT / ASIC physical design flow, including synthesis, floorplanning, P&R, CTS, parasitic extraction, STA, timing closure, physical verification, power analysis, formal verification, DFT / DFM, and ATPG, Experience with deep sub-micron process technologies, 28nm or below, Strong understanding of industry-standard design processes for deep sub-micron designs