Electronic Packaging Design Engineer 2095

ARTS, part of the TSG Group, is looking for an Electronic Packaging Design Engineer to join its R&D team.

The position is based in Yavne, Israel.

Responsibilities:

• Mechanical design and electronic packaging of complex electronic systems, from concept through production.

• Design of rugged enclosures, thermal solutions, and integration of cabling and electronic circuit boards.

• Working with subcontractors and leading tasks end-to-end.

Requirements:

• At least 2 years of experience in electronic packaging design or mechanical design of electromechanical systems.

• Experience with SolidWorks and/or AutoCAD.

• Experience designing enclosures, cabling, connectors, or integrating electronic boards.

• Experience working with manufacturing teams and subcontractors.

• Ability to work independently, with strong organizational skills and attention to detail.

• Experience in the defense industry or familiarity with military standards - an advantage.