- B.Sc. in Electrical Engineering, Electronics Engineering, or a related discipline from an accredited university
- 10+ years of hands-on experience in Hardware Engineering and Board Design
- 1+ years of proven leadership experience as a Hardware Team Lead, Group Lead, or Technical Lead
- Strong, deep expertise in High-Speed Board Design, Multi-Layer PCB Architecture, and High-Speed Interfaces (e.g., PAM4, PCIe, SerDes)
- Proven background in ASIC Integration, Silicon Bring-Up, and System-Level Hardware Design
- Background in High-Scale Networking Systems, Ethernet Switches, Telecommunications, or Data Center Infrastructure
חולץ מתיאור המשרה · מתעדכן אוטומטית
תיאור המשרה המלא
המשרה המקורית · נשמר לעיוןA premier, market-leading Israeli Deep-Tech Semiconductor enterprise engineering next-generation silicon architectures and high-speed networking systems for massive-scale AI infrastructure, Hyperscale Data Centers, and High-Performance Computing (HPC).
Founded by industry pioneers with legendary track records in the global semiconductor domain and backed by hundreds of millions of dollars in prominent funding, the company delivers mission-critical hardware to world-renowned global enterprise leaders.
Employing hundreds of top-tier hardware, silicon, and system engineers, the company operates multiple cutting-edge R&D centers across Israel to offer maximum geographic flexibility and work-life balance.
Located across three R&D hubs , operating on a flexible hybrid work model with 2–3 days WFH per week.
Role Description
• Serving as a Hardware Development Team Lead, managing and mentoring a high-caliber engineering squad of 3–5 Board and System Hardware Engineers.
• Taking complete, end-to-end technical ownership over the hardware architecture, system-level design, and execution of ultra-high-bandwidth Next-Gen Ethernet Switch systems (51.2T / 102.4T+).
• Leading complex High-Speed Board Design and multi-layer PCB development incorporating cutting-edge signaling technologies (112G / 224G PAM4 SerDes, PCIe Gen5/Gen6).
• Overseeing deep ASIC Integration, high-current Power Delivery Network (PDN) architectures supporting hundreds of Amperes, and advanced thermal/mechanical system design.
• Driving lab Bring-Up strategies, signal/power integrity validation (SI/PI), and hardware productization for hyper-scale network platforms.
• Collaborating cross-functionally with Silicon/ASIC Architects, Firmware/Software teams, Signal Integrity experts, and tier-1 global manufacturing partners.
Requirements-
• B.Sc. in Electrical Engineering, Electronics Engineering, or a related discipline from an accredited university – Mandatory
• 10+ years of hands-on experience in Hardware Engineering and Board Design – Mandatory
• 1+ years of proven leadership experience as a Hardware Team Lead, Group Lead, or Technical Lead – Mandatory
• Strong, deep expertise in High-Speed Board Design, Multi-Layer PCB Architecture, and High-Speed Interfaces (e.g., PAM4, PCIe, SerDes) – Mandatory
• Proven background in ASIC Integration, Silicon Bring-Up, and System-Level Hardware Design – Mandatory
• Deep understanding of Power Delivery Networks (PDN), High-Current Power Design, and Signal Integrity fundamentals – Mandatory
• Strong leadership capabilities, architectural vision, and excellent collaborative skills – Mandatory
• Background in High-Scale Networking Systems, Ethernet Switches, Telecommunications, or Data Center Infrastructure – Significant Advantage
שאלות על המשרה
- המשרה לא ציינה שכר. אנחנו מציגים שכר רק כשהמעסיק מפרסם אותו.
- B.Sc. in Electrical Engineering, Electronics Engineering, or a related discipline from an accredited university, 10+ years of hands-on experience in Hardware Engineering and Board Design, 1+ years of proven leadership experience as a Hardware Team Lead, Group Lead, or Technical Lead, Strong, deep expertise in High-Speed Board Design, Multi-Layer PCB Architecture, and High-Speed Interfaces (e.g., PAM4, PCIe, SerDes), Proven background in ASIC Integration, Silicon Bring-Up, and System-Level Hardware Design