Microfabrication and Characterization Engineer

Location: Tel Aviv University (main) and Weizmann Institute, Rehovot

Classification: Full time, on site

About The Company

The company is developing a silicon-compatible photonics platform that integrates high-speed, low-energy electro-optic performance into standard silicon manufacturing. This proprietary technology targets high-bandwidth optical modulation for data centers and telecom, with future use in quantum and RF photonics.

Job Description

Join our team as a Microfabrication and Characterization Engineer to lead the thin-film deposition and complex post-processing of advanced dielectrics used in next-generation MEMS, RF acoustic resonators, and integrated photonic circuits. The ideal candidate will have deep expertise in reactive magnetron sputtering, specialized dry/wet etching, and advanced metrology.

Responsibilities:

Reactive sputtering engineering: Hands-on PVD expertise in pulsed-DC magnetron sputtering/co-sputtering, target conditioning, and tuning parameters for stress, crystallinity, and defect control via temperature and seed-layer engineering.

Etch and post-processing integration: Experience with ICP-RIE dry etching (chlorine/fluorine chemistries), hard-mask integration, wet etching, and CMP.

Metrology and characterization: Expertise in XRD, AFM/SEM, TEM, EDS, XPS, spectroscopic ellipsometry, spectrophotometry, and wafer-level stress analysis via profilometry or optical measurements.

Requirements:

M.Sc./Ph.D. in Engineering or Science

3+ years of hands-on cleanroom process engineering experience in thin-film deposition, MEMS, RF acoustic devices, integrated photonics, semiconductor fabrication, or advanced materials processing.

Hands-on experience with characterization instruments, including SEM, EDS, TEM, XRD, profilometry, spectrophotometry, and ellipsometry.

Ability to analyze process data, identify root causes of film or device defects, and implement corrective actions through structured experimentation.

Experience working with wafer-level fabrication flows, process documentation, cleanroom safety protocols, and tool maintenance procedures.

Breaking the Silicon Wall

Comfortable working in an early-stage, fast-moving technical environment with limited process infrastructure and high ownership expectations.

Strong communication skills and ability to work closely with device, photonics, RF, MEMS, and external foundry or vendor teams.

Preferred:

Experience with advanced dielectric, piezoelectric, ferroelectric, or acoustic thin films used in MEMS, RF resonators, integrated photonics, or electro-optic devices.

System-level experience with silicon photonics, acoustic resonators, RF MEMS, modulators, quantum photonics, or heterogeneous integration.

Prior ownership of process modules from development through transfer, qualification, and low-volume production.

Experience setting up new cleanroom tools, defining process controls, working with equipment vendors, and building internal fabrication capability from an early stage.

Familiarity with design of experiments (DOE) and statistical process control (SPC) for process development and qualification.