Reliability Engineer

Company Overview

Teramount, a Molex company, is an innovative growth company in the field of silicon photonics packaging, solving one of the key challenges in enabling next-generation co-packaged optics solutions for AI infrastructure, Data Centers, and High-Performance Computing. Our multidisciplinary team combines optics, and packaging expertise to bring cutting-edge technologies from concept to scalable production.

Role Overview

We are looking for an experienced Reliability Engineer to lead reliability strategy, qualification, testing, and failure analysis for advanced optical connections — from fiber-to-fiber and fiber-to-chip to chip-to-chip interfaces.

This role will bridge wafer-level material and process reliability with package-level reliability, ensuring that optical assemblies and processes meet demanding telecom and datacom requirements. You will work closely with process, packaging, equipment, and manufacturing teams to identify risks, drive qualification programs, and ensure long-term product performance.

What You Will Be Doing

• Define and lead reliability strategies, qualification plans, and testing programs for photonic devices and optical assemblies.

• Lead wafer-level and package-level reliability testing, including HTOL, temperature cycling, humidity, shock, and vibration.

• Evaluate the reliability of fiber attach, die attach, optical interfaces, and associated materials and processes.

• Analyze optical performance degradation, including insertion loss and coupling stability, under environmental and mechanical stress.

• Lead failure analysis, root-cause investigations, and corrective actions for internal and field failures.

• Correlate process parameters, material selection, and manufacturing conditions with reliability performance.

• Work cross-functionally with process, assembly, equipment, and manufacturing engineering teams and external suppliers.

• Develop qualification programs aligned with relevant industry standards, including Telcordia, MIL-STD-883, and JEDEC.

• Present reliability results, risks, and qualification status to internal stakeholders and customers.

• Support reliability requirements and test infrastructure planning for new processes and facility build-outs.

What We Need to See

• B.Sc. or M.Sc. in Electrical Engineering, Materials Science, Physics, or a related technical field.

• 5+ years of experience in semiconductor, photonics, or advanced packaging reliability engineering.

• Experience with both wafer-level and package-level reliability.

• Strong understanding of photonic packaging processes, including die attach, fiber attach, and optical testing.

• Hands-on experience with environmental and mechanical reliability testing.

• Familiarity with Telcordia GR-468-CORE, MIL-STD-883, JEDEC, or similar reliability standards.

• Strong analytical and statistical skills, including reliability data analysis, Weibull analysis, and DOE.

• Proven ability to lead failure analysis and root-cause investigations.

• Strong cross-functional communication skills and experience working with engineering teams, suppliers, and customers.

• Willingness to travel approximately once per quarter, as needed.

Ways to Stand Out

• Direct experience with silicon photonics, co-packaged optics (CPO), or optical transceivers.

• Experience with fiber-attach and die-attach equipment and processes.

• Hands-on experience with optical test and measurement equipment.

• Experience with failure analysis techniques such as SEM, FIB, and cross-sectioning.

• Experience working with OSATs or contract manufacturers.

• Experience developing reliability methodologies for new technologies and manufacturing processes, rather than only executing established qualification programs.

• Experience connecting material and process behavior to long-term optical performance.