Senior Electromagnetic (EM) Engineer

About The Company

The company is developing a silicon-compatible photonics platform that integrates high-speed, low-energy electro-optic performance into standard silicon manufacturing. This proprietary technology targets high-bandwidth optical modulation for data centers and telecom, with future use in quantum and RF photonics.

Job Description

Join us as a Senior EM Engineer, one of our first hires, to lead the electromagnetic and high-speed RF design of electro-optic modulator interfaces. This hands-on role involves designing, simulating, and validating electromagnetic and microwave structures, together with supporting RFICs, that enable high-bandwidth, low-power traveling-wave modulators in close collaboration with photonic device, PIC layout, packaging, test, and foundry partners.

Responsibilities:

Design and optimize EM structures for photonic modulators, including traveling-wave electrodes, RF transmission lines, and on-chip transitions, with supporting silicon drivers.

Execute EM and circuit-level simulation workflows covering S-parameters, impedance, bandwidth, gain, linearity, noise, power consumption, eye closure, and electro-optic link performance.

Work closely with photonic device and layout engineers to translate EM/modulator design intent into manufacturable PIC and EIC layouts under foundry PDK and packaging constraints.

Support high-speed characterization of EM structures, modulators, RFICs, and EO test structures using VNAs, probe stations, oscilloscopes, BERTs, spectrum analyzers, and optical test setups.

Correlate simulation results with measured RF and EO data, identify performance gaps, and drive design iterations toward production-ready modulator interfaces.

Contribute to tape-out planning, test-chip definition, design reviews, documentation, and internal EM/RF design methodology.

Requirements:

Strong attention to detail and comfort working in an early-stage startup environment, owning problems end-to-end.

M.Sc., Ph.D., or equivalent practical experience in EE, electromagnetics, RF/microwave engineering, photonics, physics, or a related field.

Hands-on experience with EM design of high-speed microwave structures, transmission lines, and passive components; RFIC, analog, or mixed-signal circuit design experience is a plus.

Familiarity with IC design environments.

Strong proficiency with 3D and planar EM simulation tools such as HFSS, CST, Momentum, EMX, Sonnet, or ADS.

Ability to work across EM, RFIC, photonic device, layout, packaging, and test disciplines to translate evolving design intent into manufacturable, measurable hardware.

Preferred:

Prior experience with traveling-wave modulators, silicon photonics, integrated photonics, RF photonics, or high-speed electro-optic PICs.

Experience with traveling-wave electrode design, including velocity matching, impedance matching, microwave loss reduction, and RF–optical co-propagation analysis.

Experience designing or co-designing high-bandwidth electro-optic modulator interfaces, tens-of-GHz EM structures, high-speed drivers, or SerDes front ends.

Experience with CMOS, SiGe, or compound-semiconductor RFIC design for high-speed optical links.

Familiarity with Mach-Zehnder modulators, phase shifters, ring modulators, photodiodes, waveguides, RF electrodes, and high-speed EO device metrics such as Vπ, EO bandwidth, insertion loss, and extinction ratio.

Experience with driver-modulator co-design for NRZ, PAM4, coherent, or other high-speed optical modulation formats.

Experience with RF/EO characterization, including VNA calibration, on-wafer probing, S-parameter de-embedding, EO bandwidth extraction, eye diagrams, and lab automation.

Familiarity with EM–circuit co-simulation, compact-model extraction, Verilog-A, Spectre, ADS circuit models, or photonic circuit simulation.

Experience with packaging-aware EM design, including RF launches, wire bonds, flip-chip transitions, CPW/microstrip routing, ground design, and thermal constraints.

Python, MATLAB, or similar scripting experience for simulation automation, data analysis, and measurement workflows.

Prior PIC, EIC, or RFIC tape-out experience.

Location: Weizmann Institute, Rehovot

Classification: Full time, on site