Senior Mechanical Design Engineer
ืคืืจืกื ืืชืืื ยท 0 ืืืขืืืื
ืฉืืืจื, ืืืฉื ืื ืืืืงืช ืืชืืื. ืคืชืืืช ืืฉืืื ืืื ื ืืืงืืช ืืื ืฉื ืืืช.
- 4-5+ years in Electronics Packaging Design
- Proven experience in Thermal Analysis, as well as static and dynamic analysis
- Strong background in Aluminum Die Casting, plastic injection molding, and machining (DFM)
- Experience leading projects through PDR and CDR stages
- Proficiency in SolidWorks
- M.Sc. in Mechanical Engineering
ืืืืฅ ืืชืืืืจ ืืืฉืจื ยท ืืชืขืืื ืืืืืืืืช
ืชืืืืจ ืืืฉืจื ืืืื
ืืืฉืจื ืืืงืืจืืช ยท ื ืฉืืจ ืืขืืื๐ข Calling All Mechanical Design Experts! ๐ ๏ธโก
Are you a creative and driven Mechanical Design Engineer looking for your next challenge? We are looking for a top-tier engineer to join a global leader in innovative wireless communication technology.
If you thrive in a "hands-on" environment, love end-to-end product development, and have a sharp eye for Electronics Packaging, we want to meet you.
The Role: You will be responsible for the mechanical development of next-generation products, from initial concept to mass production. This is a high-impact role within a small, expert team where your technical contribution is felt in every product.
What are we looking for?
โ Experience: 4-5+ years in Electronics Packaging Design (A must-have).
โ Core Expertise: Proven experience in Thermal Analysis, as well as static and dynamic analysis. โ Manufacturing Pro: Strong background in Aluminum Die Casting, plastic injection molding, and machining (DFM).
โ Full Life-Cycle: Experience leading projects through PDR and CDR stages.
โ Software: Proficiency in SolidWorks.
โ Education: B.Sc. in Mechanical Engineering (M.Sc. is an advantage).
Why this role?
โข Work on cutting-edge wireless equipment.
โข Join a small, collaborative team where your voice is heard.
โข True end-to-end responsibilityโfrom a blank page to a product in the field.
๐ Location: Central Israel / Sharon Area.
ืฉืืืืช ืขื ืืืฉืจื
- ืืืฉืจื ืื ืฆืืื ื ืฉืืจ. ืื ืื ื ืืฆืืืื ืฉืืจ ืจืง ืืฉืืืขืกืืง ืืคืจืกื ืืืชื.
- 4-5+ years in Electronics Packaging Design, Proven experience in Thermal Analysis, as well as static and dynamic analysis, Strong background in Aluminum Die Casting, plastic injection molding, and machining (DFM), Experience leading projects through PDR and CDR stages, Proficiency in SolidWorks