SRAM Design Lead / Architect
פורסם לפני 18 ימים · 0 מועמדים
התפקיד במילים פשוטות
תפקיד מוביל ומארכיטקט תכנון SRAM בחברת Xsight Labs. התפקיד כולל הגדרת ארכיטקטורת זיכרון מוטמע, קבלת החלטות תכנוניות המאזנות בין שטח, הספק, מהירות ותפוקה (yield), והובלת צוות מהנדסים משלב המפרט ועד ל-tapeout.
- 15+ years in analog/mixed-signal or memory circuit design with direct SRAM tapeout experience
- Hands-on experience designing SRAM at or near the leading edge (advanced FinFET or GAA/nanosheet nodes)
- Deep understanding of bitcell physics, sense amp design, and SRAM failure modes
- Track record of taking multiple custom memory designs from spec to silicon, including bleeding-edge node
- Strong grasp of yield/Monte Carlo analysis under advanced-node variation
- Experience with GAA/nanosheet transistor architectures
- Direct collaboration history with foundry DTCO teams
- Prior people-management or technical-lead experience
- Familiarity with memory compiler architectures (Synopsys, Cadence, or in-house)
חולץ מתיאור המשרה · מתעדכן אוטומטית
למי זה מתאים
התפקיד מתאים למהנדסי תכנון מעגלי זיכרון אנלוגיים/מעורבים בעלי 15 שנות ניסיון לפחות וניסיון מוכח ב-tapeout של SRAM בטכנולוגיות מתקדמות. הוא פחות מתאים למהנדסים מתחילים או ללא ניסיון עמוק ב-FinFET/GAA ועבודה מול foundry.
תיאור המשרה המלא
המשרה המקורית · נשמר לעיוןSummary We're looking for a principal-level SRAM design lead to architect and drive custom embedded memory development on our most advanced process node, from specification through tapeout. You'll own the technical roadmap for our SRAM instances, set architecture decisions that balance area, power, speed, and yield under aggressive variation and leakage constraints, and lead a team of circuit, layout, and verification engineers through the full design cycle. Responsibilities • Define SRAM architecture: bitcell selection, array organization, redundancy scheme, and target PPA specs under advanced-node variation and leakage constraints • Make key trade-off calls between density, speed, power, and yield at the leading edge of the process roadmap • Coordinate across circuit design, layout, verification, and DFT to keep the project on schedule despite the added complexity of a bleeding-edge node • Own the memory compiler or hard-macro generation strategy if instances need to be configurable • Interface directly with foundry PDK and DTCO teams on process-specific constraints, including early-silicon or pre-production PDKs • Review and sign off on critical design decisions, corner cases, and tapeout readiness • Set the technical bar for the team and mentor senior engineers navigating a new node for the first time
Requirements: Required qualifications • 15+ years in analog/mixed-signal or memory circuit design, with direct SRAM tapeout experience across multiple process generations • Hands-on experience designing SRAM at or near the leading edge (advanced FinFET or GAA/nanosheet nodes) • Deep understanding of bitcell physics, sense amp design, and SRAM failure modes under high process variation and low-voltage operation • Track record of taking multiple custom memory designs from spec to silicon, including at least one on a bleeding-edge node • Strong grasp of yield/Monte Carlo analysis under advanced-node variation, and how it drives design margin decisions • Experience working directly with foundry PDKs, including engagement during early or pre-production PDK phases Preferred qualifications • Experience with GAA/nanosheet transistor architectures specifically, not just FinFET • Direct collaboration history with foundry DTCO (design-technology co-optimization) teams • Prior people-management or technical-lead experience • Familiarity with memory compiler architectures (Synopsys, Cadence, or in-house)
שאלות על המשרה
- המשרה לא ציינה שכר. אנחנו מציגים שכר רק כשהמעסיק מפרסם אותו.
- 15+ years in analog/mixed-signal or memory circuit design with direct SRAM tapeout experience, Hands-on experience designing SRAM at or near the leading edge (advanced FinFET or GAA/nanosheet nodes), Deep understanding of bitcell physics, sense amp design, and SRAM failure modes, Track record of taking multiple custom memory designs from spec to silicon, including bleeding-edge node, Strong grasp of yield/Monte Carlo analysis under advanced-node variation